NCP5050
PACKAGE DIMENSIONS
WDFN10, 3x3, 0.5P
CASE 522AA ? 01
ISSUE A
D
A
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
E
PAD AS WELL AS THE TERMINALS.
PIN ONE
REFERENCE
DIM
A
A1
MIN
0.70
0.00
MILLIMETERS
NOM MAX
0.75 0.80
0.03 0.05
2X
0.15 C
A3
b
0.18
0.20 REF
0.24 0.30
2X
0.15 C
TOP VIEW
A3
D
D2
E
E2
2.45
1.75
3.00 BSC
2.50 2.55
3.00 BSC
1.80 1.85
0.10 C
A
e
K
L
0.35
0.50 BSC
0.19 TYP
0.40 0.45
10X
0.08 C
SIDE VIEW
A1
C
SEATING
PLANE
SOLDERING FOOTPRINT*
D2
2.6016
10X
L
1
5
e
E2
2.1746
1.8508 3.3048
0.5651
10X
K
10 6
BOTTOM VIEW
b
10X
0.10 C A B
0.05 C NOTE 3
10X
10X
0.3008
0.5000 PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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NCP5050/D
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